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SAMSUNG: UFS 3.1 parts

30
Issuing time:2024-03-19 13:58Author:glochip.comSource:GlobalizeX.COMLink:https://www.glochip.com/news/
Version
Capacity
Voltage
Interface
Package Size
Temperature
Product Status
KLUDG4UHGC-B0E1
UFS 3.1
128 GB
1.2 / 2.5 V
G4 2Lane
11 x 13 x 0.8 mm
-25 ~ 85 °C
Mass Production
KLUEG4RHGB-B0E1
UFS 3.1
256 GB
1.2 / 2.5 V
G4 2Lane
11 x 13 x 0.8 mm
-25 ~ 85 °C
Mass Production
KLUEG8UHGC-B0E1
UFS 3.1
256 GB
1.2 / 2.5 V
G4 2Lane
11 x 13 x 0.8 mm
-25 ~ 85 °C
Mass Production
KLUFG4LHGC-B0E1
UFS 3.1
512 GB
1.2 / 2.5 V
G4 2Lane
11 x 13 x 1.0 mm
-25 ~ 85 °C
Mass Production
KLUFG8RHGB-B0E1
UFS 3.1
512 GB
1.2 / 2.5 V
G4 2Lane
11 x 13 x 1.0 mm
-25 ~ 85 °C
Mass Production
KLUGGARHGB-B0E1
UFS 3.1
1 TB
1.2 / 2.5 V
G4 2Lane
11 x 13 x 1.25 mm
-25 ~ 85 °C
Mass Production
KLUCG2UHYB-B0EP
UFS 3.1
64 GB
1.2 / 2.5 V
G4 2Lane
11.5 x 13 x 1.2 mm
-40 ~ 95 °C
Mass Production
KLUCG2UHYB-B0EQ
UFS 3.1
64 GB
1.2 / 2.5 V
G4 2Lane
11.5 x 13 x 1.2 mm
-40 ~ 105 °C
Mass Production
KLUDG4UHYB-B0EP
UFS 3.1
128 GB
1.2 / 2.5 V
G4 2Lane
11.5 x 13 x 1.2 mm
-40 ~ 95 °C
Mass Production
KLUDG4UHYB-B0EQ
UFS 3.1
128 GB
1.2 / 2.5 V
G4 2Lane
11.5 x 13 x 1.2 mm
-40 ~ 105 °C
Mass Production
KLUEG8UHYB-B0EP
UFS 3.1
256 GB
1.2 / 2.5 V
G4 2Lane
11.5 x 13 x 1.2 mm
-40 ~ 95 °C
Mass Production
KLUEG8UHYB-B0EQ
UFS 3.1
256 GB
1.2 / 2.5 V
G4 2Lane
11.5 x 13 x 1.2 mm
-40 ~ 105 °C
Mass Production
KLUFGAUHYB-B0EP
UFS 3.1
512 GB
1.2 / 2.5 V
G4 2Lane
11.5 x 13 x 1.72 mm
-40 ~ 95 °C
Mass Production
KLUFGAUHYB-B0EQ
UFS 3.1
512 GB
1.2 / 2.5 V
G4 2Lane
11.5 x 13 x 1.72 mm
-40 ~ 105 °C
Mass Production
KLUDG4UHDB-B2E1
UFS 3.1
128 GB
1.2 / 2.5 V
G4 2Lane
11.5 x 13 x 0.8 mm
-25 ~ 85 °C
Mass Production
KLUEG8UHDB-C2E1
UFS 3.1
256 GB
1.2 / 2.5 V
G4 2Lane
11.5 x 13 x 1.0 mm
-25 ~ 85 °C
Mass Production
KLUFG8RHDA-B2E1
UFS 3.1
512 GB
1.2 / 2.5 V
G4 2Lane
11.5 x 13 x 1.0 mm
-25 ~ 85 °C
Mass Production


Note： http://chip.com.pk/h-nd-551.html
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